Our Capabilities
Advanced PCB Engineering Expertise
From concept to production, we deliver comprehensive PCB design and manufacturing solutions tailored to your specific requirements.
Our Capabilities
PCB Manufacturing & Multilayer Trading Capabilities
Manufacturing Capabilities (Up to 6 Layers)
• Layer Count: Up to 6 Layers
• Glass Transition (Tg): 135°C – 170°C
• Max Board Thickness: 3.20 mm
• Min Finished Thickness: 0.40 mm
• Copper Thickness: Up to 210 Microns
• FR-4, FR-1, CEM-1, Aluminum Clad (ALCCL)
• High Tg FR-4, Halogen Free Materials
• Advanced Laminates: Rogers, Panasonic (Megtron), Isola, Shengyi, Kingboard, ITEQ, Nanya Plastics
• Min Hole Size: 0.20 mm
• Aspect Ratio: 10:1
• Tolerance: ±0.05 mm
• HASL / Lead-Free HASL
• OSP, ENIG, Electrolytic Gold
• Immersion Tin, Lacquer
• Carbon Printing, Peelable Mask
• Via Filling (Ink/Resin), Metal Capping
Multilayer PCB Trading Capabilities (2–48 Layers)
• Layer Count: 2–48 Layers
• Thickness: 0.1 – 6.35 mm
• Min Track/Space: 64μm / 64μm
• Copper: 6 OZ (Inner), 10 OZ (Outer)
• Aspect Ratio: 20:1
• Impedance Tolerance: ±8%
• Materials: Rogers, Arlon, AGC, Panasonic, PPO/PPE, PTFE + Ceramic
• Frequency: Up to 128 GHz
• Transmission Rate: Up to 128 Gbps
• Sequential Lamination & Back Drilling Supported
• Lamination Structure: 7+N+7
• Min Laser Via: 70μm
• Stacked Microvias Supported
• Min W/S: 25μm / 25μm
• Interlayer Alignment: ≤10μm
• Mini-LED Pitch: P0.6 mm
• Symmetrical & Asymmetrical Structures
• Min Flex Thickness: 12.5μm
• OSP, HASL LF, ENIG, ENEPIG
• Hard Gold / Soft Gold, Immersion Silver, Immersion Tin
• Blind & Buried Vias, Resin Plugging, Edge Plating
• Heavy Copper, Back Drill, Embedded Copper
• In-house Manufacturing up to 6 Layers
• Global Multilayer Sourcing up to 48 Layers
• High-Frequency, HDI & Automotive PCB Solutions
